Thin-film deposition covers any technique for depositing material onto a bulk or thin film substrate. Elemental alloy or compound films are produced by non-reactive or reactive (co-)deposition. Often functionalization or tayloring of device interfaces by predeposition or deposition assisting surface treatment with atoms or ions is necessary.
Using synergies within the Network Of Competence SPECS stands for experienced consultation and design of complete, customized thin film preparation or deposition solutions for all chemical and physical deposition applications. Integration with state-of-the-art surface analysis techniques can easily be realized. SPECS offers robust, highly reliable and precise single components for thin film deposition and surface modification:
- Reflection High Energy Electron Diffraction (RHEED) electron gun (RHD-30) for thin film growth analysis.
- Single (EBE-1) and multi pocket electron beam evaporator (EBE-4) for deposition of thin metal and compound films with highest purity. The sources can be used with rods and crucibles in every configuration needed and upgraded with a wide variety of accessories.
- Electron Cyclotron Resonance (ECR) (PCS-ECR and MPS-ECR ) and Radio Frequency (RF) excited plasma cracker sources (PCS-RF ) for surface modification and deposition assisting surface treatment with inert or reactive atom or ion species. The sources can be reconfigured for new applications and be used as plasma source, atom source or ion source.
- Thermal gas cracker source (TGC-H) for pure atomic hydrogen surface treatment.
